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Obsolescence Planning / SLiM

Obsolescence planning is a critical component of every program. Teledyne e2v’s Semiconductor Lifecycle Management program (SLiM) provides long-term, proactive assurance of continuity of supply for critical components. SLiM supports platform life extension helping our customers avoid the need for expensive redesign and requalification when an original component becomes obsolete during the lifetime of the system, and offers the potential for improved integrity, counterfeit avoidance, lower costs, and reduced risk over the lifetime of the assets.

This new standard in semiconductor obsolescence management provides:

  • A wide range of semiconductor products
  • Redesign and re-engineering facilities
  • Wafer and device banking for lifetime continuity of supply
  • High-reliability test and packaging services
  • Protection against counterfeit risks
  • DLA-qualified manufacturer listing

With 35 years experience in die banking, repackaging and testing of available product, and re-engineering of hi-rel designs, Teledyne e2v can help manage obsolescence of key semiconductor components at the start of or through the life of a program.

Use the table below to access our list of live PCNs and EOLs, if you would like to receive a notification of future PCN/EOL releases, please subscribe via the button below:

 

 

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Please complete the form below to subscribe for Product Change Notification and End of Life documentation alerts from the Semiconductors team. The information you provide here will be used only for PCN/EOL alerts and will not be added to any other mailing lists.