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Assembly & Test

In addition to, and complementing our range of semiconductor products, Teledyne e2v also offers hi-rel assembly, testing and packaging services at both our production sites located in the US and Europe, specifically:

  • State-of-the-art manufacturing, qualified to QML Class Q and V in both US and European locations
  • Wafer processing capability – hot and cold temperature handling and testing
  • Package redesign and characterization with thermal analysis and qualification
  • Hi-rel screenings, burn-in, life-testing – custom screening options available on request
  • Complete test development, migration and military temperature qualification
  • Enhanced processing of COTS devices over the full military temperature range
  • Packaging and test capability retained for mature products and processes
  • Test equipment maintained for mature products with porting to new test equipment as required