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Industrialization and Manufacturing Services

Teledyne e2v Grenoble provides state-of-the-art Assembly & Test services to customers seeking high-end packaging technologies.

  • Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
  • Tailor-made approach
  • Low and medium volume
  • Hi-Rel / High-end / Specific Assembly & Test
  • Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
  • Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
  • Segregation of data and flow as per customer request