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TBGA Pad Layout

Post Date:
07/16/07 
Question:
What is the recommended pad layout for the TBGA packages (with Sn63Pb37 balls) offered with e2v Broadband Data Conversion devices?
Answer:
Description
Dimensions
e2v Rules
mm
mil
Component Land Pad Diameter (Pad)
--
0.75
29.5
Solder Land Diameter
L
0.71
28
Opening in Solder Mask Diameter
M
0.71
28
Solder (Ball) Land Pitch
e
1.27
50
Line Width Between Via and Land
W
0.51
20
Distance Between Via and Land
D
0.71
28
Via Land Diameter
VL
0.66
26
Through Hole Diameter
VH
0.38
15