High speed ADC board ground planes

Post date:

07/16/07

Question:

Do I have separate the digital and analog ground planes on the
board integrating a high speed e2v ADC ?

Answer:

On e2v High Speed ADCs (TS8308500, TS8388B, TS83102G0B,
AT84AS003,AT84AS008…), the digital ground is separated from
the analog ground at the die level but the planes are reunited at
the package level and thusthere is only one common ground
(both analog and digital) to manage atthe board level.

There is no need to separate the analog and digital ground at
the packageand board levels (unless otherwise specified depending on the device atstake), nevertheless, it is recommended to have a different digital ground plane for the digital circuits of the board, for example if you have the ADC, the DMUX and the FPGA on the same board.