Complex aerospace & defence equipment is at risk from the effects of unmanaged semiconductor obsolescence before and after entering service.
Specifically, the accelerating pace of semiconductor product change and development requires new approaches to the design, manufacture and through life support of aerospace & defence, and long life cycle commercial systems, to prepare for and establish effective semiconductor obsolescence management and mitigation processes.
e2v delivers security of through-life supply with our semiconductor lifecycle management programme (SLiM™), a new standard in semiconductor obsolescence management, providing:
- A range of hi-rel semiconductor products, including QP Semiconductor product line
- Redesign and reengineering facilities
- Wafer banking and lifetime continuity of supply
- Hi-Rel test & packaging services
- Protection against counterfeit risks
- DSCC qualified manufacturer listing
Whilst obsolescence management is an established approach, the reality of support and expertise available from many suppliers in this market space is limited to fire fighting the obsolescence problem after it has occurred, with an inefficient and unreliable ad-hoc approach. However, with 25 years experience in die banking, repackaging and testing of available product to military specifications, and reengineering of hi rel designs, e2v’s specialist semiconductor division is able to offer security of through-life supply via our new semiconductor lifecycle management (SLiM™) programme, a process which plans for obsolescence mitigation of key semiconductor components at the start of a product or system development, rather than 10 years into its usage.