Test and Screening
e2v offers specific services for customised solutions,including extended temperature testing.
Test Engineering
- Test program transfer or development
- Test Interface design and manufacturing
- Qualification: Life-test, environmental testing
Production Test
- Wafer probe test: -40°C to +125°C (-55°C to 200°C with EG6000)
- Package test: -55°C to +125°C and up to +150°C
- 24 hours operation for ultimate responsiveness
Wide Variety of State-of-the-art and Legacy Testers
- Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, NexTest Maverick II, HP 82000, Credence/TMT ASL1000, Mega Test, Schlumberger s1650, Fairchild Sentry VII, 21, Eagle 5XP-d
- Mixed & RF ICs: Teradyne A567, A585
CCD and CMOS Image Sensor Testers
Low/High Temperature Handler and Probers
Dimensional Test
Burn-in and Screening
Test and reliability Services
- Bond strenght
- Fine and gross leak
- Lead finish adhesion
- Mechanical shock
- Particule impact noise detection (PIND)
- Resistance to solvents
- Solderability
- Thermal shock
- Constant acceleration
- Instrumental gas analysis (IGA)
- Lead integrity
- Moisture resistance
- Resistance to solder heat
- Salt atmosphere
- Temperature cycling
- Vibration