Hi-rel semiconductor solutions

Test and Screening

e2v offers specific services for customised solutions,including extended temperature testing.


Test Engineering

  • Test program transfer or development
  • Test Interface design and manufacturing
  • Qualification: Life-test, environmental testing

Production Test

  • Wafer probe test: -40°C to +125°C (-55°C to 200°C with EG6000)
  • Package test: -55°C to +125°C and up to +150°C
  • 24 hours operation for ultimate responsiveness

Wide Variety of State-of-the-art and Legacy Testers

  • Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, NexTest Maverick II, HP 82000, Credence/TMT ASL1000, Mega Test, Schlumberger s1650, Fairchild Sentry VII, 21, Eagle 5XP-d
  • Mixed & RF ICs: Teradyne A567, A585

CCD and CMOS Image Sensor Testers


Low/High Temperature Handler and Probers


Dimensional Test


Burn-in and Screening

Test and reliability Services 

  • Bond strenght
  • Fine and gross leak
  • Lead finish adhesion
  • Mechanical shock
  • Particule impact noise detection (PIND)
  • Resistance to solvents
  • Solderability
  • Thermal shock
  • Constant acceleration
  • Instrumental gas analysis (IGA)
  • Lead integrity
  • Moisture resistance
  • Resistance to solder heat
  • Salt atmosphere
  • Temperature cycling
  • Vibration