Assembly Services

Taking advantage of its outstanding manufacturing capabilities e2v offers a wide range of assembly and packaging solutions.

Manufacturing Capabilities

•  Hi-Rel assembly facilities in the US, Europe and Asia
• 24 hours operation for ultimate responsiveness
• Class 100 clean room in the US and Europe
• Die processing assembly capacity: GelPack delivery
• Low and medium volume (up to 1M/year)

Specific Packaging 

• Package design, thermal and electrical simulation, characterisation
• Package assembly in multiple worldwide locations
• Hermetic ceramic packages: DIP, LCC,  CPGA, CQFP, CBGA, CAN
• Support for leaded packages to satisfy legacy system requirements
• Wide range of plastic COTS packages
• RoHS-compliant packages available for both ceramic and plastic
• Flip-Chip assembly on ceramic substrate (CBGA)
• Multi-Chip modules
• High-End organic packages : EBGA