HEP Capabilities
High Energy Physics capabilities
e2v has extensive design and pre-production capabilities, including computer aided modelling, mechanical design, external component procurement expertise, and in-house component manufacture. The Company has in-house test facilities for both low and high power component and sub-assembly test for its full range of products. For CCDs, e2v carries out in-house cryogenic, thermoelectric, vacuum and room temperature testing. A full range of in-house environmental testing and screening is also possible.
Production areas
e2v has a number of controlled areas dedicated to serial device production. Devices are assembled to strict build instructions by teams of trained operators using characterised and calibrated equipment. For e2v’s switching products, for example, assembly is completed by a team of skilled operators, who are well versed in spot / arc welding processes and step furnace brazing. Techniques ensure accurate component alignment. Helium mass spectrometry is integral to many of e2v’s assembly processes, in order to check vacuum integrity at every stage of the assembly. Post assembly vacuum devices are pumped and tested on specialist, dedicated equipments to verify correct operation prior to despatch.
Process development
A group of technical experts focus on the improvement of in-house manufacturing and development processes. Incremental improvements are continually underway and make a positive contribution to e2v's "right first time" record.
Joining special materials
The reliable joining of dissimilar materials is crucial for successful manufacture of the range of e2v devices. e2v has many years of in-house experience in producing mechanically strong and hermetic joints. Our capability extends to the joining of dissimilar metals, joining metals to glass and joining metals to ceramics.
Cathode development
A reliable supply of high quality electron emitters is important for success in the high power RF business. e2v has developed and maintains an in-house cathode design and manufacturing facility, which has both the tools and skills required to produce consistent, high quality electron emitters for a range of RF devices.
Component cleaning technology
Chemical processing plays a large part in e2v’s product manufacture. All processes, including electrolytic and electro-less plating, acid cleaning and furnacing (hydrogen, wet gas, vacuum, dry gas), are carried out by trained operators and are controlled by written specification and procedures.
CCD package and fabrication capabilities
e2v has extensive in-house capabilities for CCD manufacture, including in-house CCD wafer fabrication; wafer dicing, die etch and wire bonding; fibre optic coupling; multi-chip focal plane arrays; customer-specific encapsulation and output connections; optional scintillator; spectral bandpass/optimisation and anti-reflective coating.