CBGA Pad Layout (Sn63Pb37 balls)

Post Date:

07/16/07

Question:

What is the recommended pad layout for the CBGA packages (with Sn63Pb37 balls) offered with e2v Broadband Data Conversion devices?

Answer:

Description	Dimensions	e2v Rules
Description	Dimensions	mm	mil
Component Land Pad Diameter (Pad)	--	0.76	30
Solder Land Diameter	L	0.71	28
Opening in Solder Mask Diameter	M	0.71	28
Solder (Ball) Land Pitch	e	1.27	50
Line Width Between Via and Land	W	0.51	20
Distance Between Via and Land	D	0.71	28
Via Land Diameter	VL	0.66	26
Through Hole Diameter	VH	0.38	15