Backthinning Wafer Process Engineer (6 month rolling contract)
e2v is a leading global provider of technology solutions for high performance systems; delivering solutions, sub-systems and components, to advanced systems companies, for specialist applications within medical & science, aerospace & defence, and commercial & industrial markets.
e2v technologies imaging sensors are responsible for many of the amazing images being delivered by missions such as NASA's Kepler, Solar Dynamics Observatory (SDO) and the Hubble Space Telescope.
We have a number of exciting opportunities to become involved in Britain’s rapidly growing Space & Astronomy industry.
Purpose:
To develop to production handover, processes necessary for the patterning and etching of layers necessary for novel anti-reflection coatings and storeshields on thinned imaging sensors.
Duties:
The development, evaluation and documentation of the above. Including writing of intial operating procedures, collating test data for process release and any associated safety assessments
Ideal Experience:
Experience of semiconductor processing in a volume or prototyping environment would be preferable.
Ideally in wet or dry etching & aligner or stepper photolithography. Othe relevant experience will be considered.
Ability with MS Office and familiarity with statistical process tools also an advantage.
e2v recognise the valued service provided by those agencies and recruitment suppliers contracted to provide recruitment solutions and instructed to submit candidates. As such, we have a Preferred Supplier List (PSL) of Agencies and Retained Search / Head-hunters with whom we have agreed terms and conditions.
Please note we do not acknowledge/accept unsolicited CVs or approaches (phone or email) from recruitment agencies, search firms or consultancies and we will not enter into assignments with any suppliers other than those on our preferred supplier list. The PSL is not being reviewed at this time and is now closed to new suppliers. Any updates will be published here.